TECoCIP

The embedding of electronic components in printed circuit boards is an attractive technology which offers high electrical and thermal performances, while building upon a mature industrial ecosystem. However, most of the research has only focused so far on embedding power semiconductor dies, and the proposed solutions require very specific components. TECoCIP aims at fostering the development of the embedding technology by 1-proposing a "pre-package" which allows for easy integration of any active component (power dies as well as integrated circuits); 2-investigating embedded magnetic components, which are required to build a power electronic converter; 3-assessing the thermo-mechanical behaviour of embedded assemblies. To achieve its objectives, the work plan of TECoCIP involves technological development, electro-magnetic and thermo-mechanical modelling, and experimental validation on a large set of prototypes.