Most of the recent electronic devices communicate and much more in the near future. Their use and therefore their production will increase exponentially. However, a number of important scientific and technological drawbacks appear on the current hardware and method. The Photon'Ink project, based on a consortium between 2 French academic laboratories and 2 French industries of the printed electronic field, is to study and develop new chemical pathways combined with a physical post treatment at room temperature for copper interconnect. In this framework, the focus will be on the characterization and understanding of the relationship between structure and conductivity of the resulting copper interconnects. This combined approach, both on fundamental and applied research, will lead to the creation of new products and high value-added processes.
