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assignment_turned_inProject
Completed

HERMES

High density integration by embedding chips for reduced size modules and electronic systems

Project website
FunderEuropean Commission
Duration01 May 2008 - 29 Feb 2012
Funded underFP7 | SP1 | ICT
Call for proposalFP7-ICT-2007-2
Project code224611
Open Access mandatePublications: NoResearch data: No
Identifiers
Project timeline100%
corporate_fare13Partners
location_on6Countries

Description

N/A

Partners (13)

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Data Management Plans

argos Start a new DMP in Argos