CONNECTIVE

The aim of the CONNECTIVE project is to develop and industrialize a standardized production process for Cu-based inks and pastes, optimized for high-performance applications in semiconductors (SCs), photovoltaics (PVs), and printed electronics. The project represents a deep tech breakthrough in nanomaterial synthesis and formulation, enabling the development of an air-sinterable Cu ink. Unlike existing solutions, this innovation eliminates the need for controlled atmospheres, significantly reducing manufacturing complexity and cost. The project tackles the longstanding challenge of oxidation during sintering, a critical barrier to Cu adoption, through proprietary surface capping agents. This pioneering effort uses advanced nanomaterial science to create scalable, sustainable, and reliable Cu-based solutions, reducing the industry's dependency on silver while ensuring compatibility with existing industrial processes. CONNECTIVE addresses critical challenges across SCs, PVs, and flexible electronics, where Ag is currently dominant. Cu is 700 times more abundant, significantly cheaper (€8/kg vs. €930/kg for Ag), and produces a lower environmental footprint (4 tCO2/ton vs. 18 tCO2/ton for Ag). By enabling air sintering and offering mechanical properties superior to Ag, the Cu inks meet the rigorous demands of high-stress applications. With Ag prices volatile and heavily impacted by geopolitical tensions, and the EU pushing for sustainability through initiatives like the Chips Act, this project is exceptionally timely. The ITRPV roadmap predicts Cu-based metallization will cover 70% of SHJ cells by 2033, underscoring the urgency of scalable Cu solutions. EIC funding is crucial to advancing this technology from TRL 5 to TRL 9, enabling industrial-scale production, securing IP, and validating formulations for market readiness. This support will position Europe as a leader in sustainable materials and strengthen its resilience against supply chain vulnerabil